Semiconductor processing utilizes a variety of strong acids for the etching of silicon wafers. Aggressive acids like Piranha (a mixture of sulfuric acid and hydrogen peroxide) need to be kept free contamination and in some settings can no longer be disposed of and require recycling.

In these environments Ultrmet CPT’s tantalum diffusion surfaces can remain inert and easily take the place of plastics that have reached their operating limits in terms of pressures and temperatures.